1. Creation of microminiature equipment with high reliability and reproducibility, low power consumption and high functional complexity for instrumentation, medical and industrial tomography, physical experiments, aviation and space applications based on Chip-on-board (COB) and Chip-on-flex (COF) technologies assembly of many crystal modules on flexible and flexible-rigid polyimide boards. 2. Development, research and production of innovative composite functional lacquer-foil polyimide materials based on copper and aluminum foils, as well as foils from nickel and constantan alloys for precision foil sensing elements, film electric heaters and flexible printed circuit boards.